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In Hak Baick

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Conference and Workshop Papers

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2018
[c2]
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  dblp key:
  - conf/irps/JeongKKKLCBKJSP18
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  persistent URL:
  - https://dblp.org/rec/conf/irps/JeongKKKLCBKJSP18
Seongwon Jeong, Jinseok Kim, Ayoung Kim, Byungwook Kim, Moonsoo Lee, Jaewon Chang, In Hak Baick, Hanbyul Kang, Younggeun Ji, Sangchul Shin, Sangwoo Pae:
Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR). IRPS 2018: 3
2015
[c1]
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  dblp key:
  - conf/irps/ChunBHKLKPP15
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  - https://dblp.org/rec/conf/irps/ChunBHKLKPP15
Hyunsuk Chun, In Hak Baick, Sangsu Ha, Eunmi Kwon, Seungbae Lee, Seil Kim, Sangwoo Pae, Jongwoo Park:
CPI reliability and EMI benefit for MIM CAP embedded C4 package. IRPS 2015: 5

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