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Sylvain Joblot

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Conference and Workshop Papers

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2014
[c2]
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  - conf/3dic/DiengABGLJHFLF14
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Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet:
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. 3DIC 2014: 1-8
2013
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Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7

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