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Cell K. Y. Wong

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2010 – 2019

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2017
[j2]
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  - journals/mr/TangYWLFCFZ17
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  - https://dblp.org/rec/journals/mr/TangYWLFCFZ17
Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang:
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component. Microelectron. Reliab. 78: 197-204 (2017)
2014
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Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo:
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54(9-10): 2028-2033 (2014)

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