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Ren-Shin Cheng

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2010 – 2019

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2015
[j1]
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  - journals/mr/ChangLHHC15
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  - https://dblp.org/rec/journals/mr/ChangLHHC15
Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng:
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectron. Reliab. 55(12): 2582-2588 (2015)
2013
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  - conf/3dic/ChienYLLCZCLHCFLSKLL13
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Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu:
Performance and process characteristic of glass interposer with through-glass-via(TGV). 3DIC 2013: 1-7

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