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Tingyu Lin 0004

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affiliation: National Center for Advanced Packaging Co., Ltd., Wuxi, Jiangsu, China

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2010 – 2019

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2018
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Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian:
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. Microelectron. Reliab. 83: 29-38 (2018)

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