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"Warpage simulation and experimental verification for ..."

Meiying Su et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.02.010

access: closed

type: Journal Article

metadata version: 2023-12-14

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Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian:
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. Microelectron. Reliab. 83: 29-38 (2018)

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