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Journal Articles
- 2017
[j2]Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
:
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 17(7): 1511 (2017)- 2009
- [j1]Heinz-Gerd Graf, Christine Harendt, Thorsten Engelhardt, Cor Scherjon, Karsten Warkentin, Harald Richter, Joachim N. Burghartz:
High Dynamic Range CMOS Imager Technologies for Biomedical Applications. IEEE J. Solid State Circuits 44(1): 281-289 (2009)
Conference and Workshop Papers
- 2016
- [c7]Muhammad Alshahed, Mohammed Alomari, Christine Harendt, Joachim N. Burghartz, C. Wachter, T. Bergunde, S. Lutgen:
600 V, low-leakage AlGaN/GaN MIS-HEMT on bulk GaN substrates. ESSDERC 2016: 202-205 - 2014
- [c6]Christine Harendt, Zili Yu, Joachim N. Burghartz, Jan Kostelnik, Andreas Kugler, Stefan Saller:
Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips. ESSDERC 2014: 210-213 - [c5]Muhammad Alshahed, Zili Yu, Horst Rempp, Harald Richter, Christine Harendt, Joachim N. Burghartz:
Thermal characterization and modeling of ultra-thin silicon chips. ESSDERC 2014: 397-400 - 2012
- [c4]Evangelos A. Angelopoulos, Muhammad S. Al-Shahed, Wolfgang Appel, Stefan Endler, Saleh Ferwana, Christine Harendt, Mahadi-Ul Hassan, Horst Rempp, Martin Zimmermann, Joachim N. Burghartz:
Manufacturing aspects of an ultra-thin chip technology. ESSDERC 2012: 141-144 - 2009
- [c3]Joachim N. Burghartz, Wolfgang Appel, Christine Harendt, Horst Rempp, Harald Richter, Martin Zimmermann:
Ultra-thin chips and related applications, a new paradigm in silicon technology. ESSCIRC 2009: 28-35 - 2008
- [c2]Joachim N. Burghartz, Thorsten Engelhardt, Heinz-Gerd Graf, Christine Harendt, Harald Richter, Cor Scherjon, Karsten Warkentin:
CMOS Imager Technologies for Biomedical Applications. ISSCC 2008: 142-143 - [c1]Horst Rempp, Joachim N. Burghartz, Christine Harendt, Nicoleta Pricopi, Marcus Pritschow, Christian Reuter, Harald Richter, Inge Schindler, Martin Zimmermann:
Ultra-Thin Chips on Foil for Flexible Electronics. ISSCC 2008: 334-335
Coauthor Index
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