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ORCIDIEEE Micro, Volume 45
Volume 45, Number 1, January - February 2025
- Hsien-Hsin S. Lee
:
Rise of the Agentic AI Workforce. 4-5 - Debendra Das Sharma, Nam Sung Kim:
Special Issue on Interconnects for Chiplet Integration Technologies. 6-8 - Boyd Phelps, Arif Khan:
Disaggregated Designs: Technology Challenges and Enablers. 9-15 - Peter Z. Onufryk, Swadesh Choudhary:
UCIe: Standard for an Open Chiplet Ecosystem. 16-25 - Au Huynh, Kent Stahn, Manuel Mota, Christian de Verteuil, Jennifer Pyon, Reza Movahedinia:
UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging. 26-34 - Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung:
Co-Design of Interchiplet, Package, and System Interconnect Protocols. 35-40 - Wei Tang, Chester Liu, Zhengya Zhang:
Energy-Efficient Parallel Interconnects for Chiplet Integration. 41-47 - Durand Jarrett-Amor, Tony Chan Carusone:
A Comparison of Single-Ended, NRZ Unidirectional Signaling and Single-Ended, NRZ Simultaneous-Bidirectional Signaling for Die-to-Die Links. 48-56 - Alan Smith, Gabriel H. Loh, Samuel Naffziger, John J. Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser:
Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator. 57-66 - Sridhar Muthrasanallur, Yervant Zorian:
A Test, Debug, and Silicon Lifecycle Management Architecture for a UCIe-Based Open Chiplet Ecosystem. 67-74 - Thommas K. S. Flores, Ivanovitch Silva, Mariana Azevedo, Thaís Medeiros, Morsinaldo Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni:
Advancing Tiny Machine Learning Operations: Robust Model Updates in the Internet of Intelligent Vehicles. 76-86 - Tomasz Szydlo, Marcin Nagy:
Management of TinyML-Enabled Internet of Things Devices. 87-94 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part II. 95-100 - Shane Greenstein:
Spillovers, Bottlenecks, and More Invention After Invention. 101-103 - Mariam Elgamal, Yueying Lisa Li:
Measuring What Matters: A Fireside Chat With Joel Emer. 104-112
Volume 45, Number 2, March - April 2025
- Hsien-Hsin S. Lee:
Taiwan Semiconductor Manufacturing Company's $165 Billion Bet. 4-5 - Whit Schonbein, Joseph Schuchart:
Special Issue on Hot Interconnects 31. 6-7 - Quentin Anthony, Benjamin Michalowicz, Jacob Hatef, Lang Xu, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni, Dhabaleswar K. Panda:
Understanding and Characterizing Communication Characteristics for Distributed Transformer Models. 8-17 - Weiyang Wang, Manya Ghobadi:
Spine-Free Networks for Large Language Model Training. 18-25 - Manjunath Gorentla Venkata, Valentine Petrov, Sergey Lebedev, Devendar Bureddy, Ferrol Aderholdt, Joshua Ladd, Gil Bloch, Mike Dubman, Gilad Shainer:
Unified Collective Communication: A Unified Library for CPU, GPU, and DPU Collectives. 26-35 - Tu Tran, Goutham Kalikrishna Reddy Kuncham, Bharath Ramesh, Shulei Xu, Hari Subramoni, Dhabaleswar K. Panda:
OHIO: Enhancing RDMA Scalability in Alltoall With Optimized Communication Overlap. 36-45 - Jinsun Yoo, William Won, Meghan Cowan, Nan Jiang, Benjamin Klenk, Srinivas Sridharan, Tushar Krishna:
Toward a Standardized Representation for Deep Learning Collective Algorithms. 46-55 - Cristina Olmedilla, Jesús Escudero-Sahuquillo, Pedro Javier García, Francisco J. Quiles, Wenhao Sun, Long Yan, Yunping Lyu, José Duato:
ECP: Improving the Accuracy of Congesting-Packets Identification in High-Performance Interconnection Networks. 56-64 - Ryusuke Egawa, Yasutaka Wada:
Special Issue on COOL Chips. 65-66 - Jueun Jung, Seungbin Kim, Bokyoung Seo, Wuyoung Jang, Sangho Lee, Jeongmin Shin, Donghyeon Han, Kyuho Jason Lee:
A Mobile Semantic Lidar SLAM Processor With Artificial-Intelligence-Based 3-D Perception and Spatiotemporal-Aware Computing. 67-77 - Hoai Luan Pham, Vu Trung Duong Le, Tuan Hai Vu, Van Duy Tran, Van Tinh Nguyen, Thi Diem Tran, Yasuhiko Nakashima:
MRCA 2.0: An Area-Optimized Multigrained Reconfigurable Cryptographic Accelerator for Securing Blockchain-Based Internet of Things Systems. 78-89 - Reoma Matsuo, Yuya Degawa, Hidetsugu Irie, Shuichi Sakai, Ryota Shioya:
Flexible Approximate Computing for Mitigating Branch Divergence in GPUs. 90-100 - Kyungsoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo:
Improving Key-Value Cache Performance With Heterogeneous Memory Tiering: A Case Study of Compute-Express-Link-Based Memory Expansion. 102-113 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part III. 114-117 - Shane Greenstein:
Artificial Intelligence and the Jevons Paradox. 118-120 - Doug Burger, Paul Chow, Joel S. Emer, Mark D. Hill, James C. Hoe, Masato Motomura:
Derek Chiou. 122-124
Volume 45, Number 3, May - June 2025
- Hsien-Hsin S. Lee:
Toward Disaggregated and Heterogenous AI Systems. 4-5 - Rob Aitken, Larry Yang:
Special Issue on Hot Chips 2024. 6-7 - Gerard Williams, Pradeep Kanapathipillai:
Qualcomm Oryon CPU in Snapdragon X Elite: Micro-Architecture and Design. 8-14 - Nadav Bonen, Arik Gihon, Leon Polishuk, Yoni Aizik, Yulia Okunev, Tsvika Kurts, Nithiyanandan Bashyam:
Lunar Lake an Intel Mobile Processor: SoC Architecture Overview (2024). 15-21 - Tomai Knopp, Jeffrey Chu, Sagheer Ahmad:
AMD Versal AI Edge Series Gen 2. 22-30 - Michael D. Powell, Patrick Fleming, Venkidesh Iyer Krishna, Naveen Lakkakula, Subhiksha Ravisundar, Praveen Mosur, Arijit Biswas, Pradeep Dubey, Kapil Sood, Andrew Cunningham, Smita Kumar:
Intel Xeon 6 Product Family. 31-40 - Alan Smith, Vamsi Krishna Alla:
AMD Instinct MI300X: A Generative AI Accelerator and Platform Architecture. 41-48 - Kaifan Wang, Jian Chen, Yinan Xu, Zihao Yu, Wei He, Dan Tang, Ninghui Sun, Yungang Bao:
XiangShan: An Open Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards. 49-57 - Kalhan Koul, Zhouhua Xie, Maxwell Strange, Sai Gautham Ravipati, Bo-Wun Cheng, Olivia Hsu, Po-Han Chen, Mark Horowitz, Fredrik Kjolstad, Priyanka Raina:
Designing Programmable Accelerators for Sparse Tensor Algebra. 58-65 - Christopher J. Berry, Michael J. Becht, Tim E. Bubb, Howard Haynie, Robert J. Sonnelitter, Katie Seggerman, Jonathan Hsieh, Edward Malley, Mike Cadigan, Susan M. Eickhoff, Matthias Klein, Craig R. Walters, Christian G. Zoellin, Cédric Lichtenau:
The IBM Telum II Processor. 66-75 - Younggeun Choi, Junyoung Park, Sang Min Lee, Jeseung Yeon, Minho Kim, Changjae Park, Byeongwook Bae, Hyunmin Jeong, Hanjoon Kim, June Paik, Nuno P. Lopes, Sungjoo Yoo:
FuriosaAI RNGD: A Tensor Contraction Processor for Sustainable AI Computing. 76-85 - Antti Rautakoura, Timo Hämäläinen, Ari Kulmala:
Three SoCs in Three Years: How to Get Agile. 86-94 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part IV. 97-102 - Jianming Tong, Zishen Wan:
Sipping Matcha of Security: A Fireside Chat With Mengjia Yan. 103-107 - Shane Greenstein:
The Scramble After Breakthrough. 108-110 - Gary S. Tyson:
Sally A. McKee. 112
Volume 45, Number 4, July - August 2025
- Hsien-Hsin S. Lee:
Intelligence for Sale. 4-5 - Jun Yang, Xulong Tang:
Special Issue on Top Picks From the 2024 Computer Architecture Conferences. 6-10 - Lieven Eeckhout:
Assessing Processor Sustainability Using the First-Order FOCAL Carbon Model. 11-18 - Jaylen Wang, Daniel S. Berger, Fiodar Kazhamiaka, Celine Irvene, Chaojie Zhang, Esha Choukse, Kali Frost, Rodrigo Fonseca, Brijesh Warrier, Chetan Bansal, Jonathan Stern, Ricardo Bianchini, Akshitha Sriraman:
Enabling Sustainable Cloud Computing With Low-Carbon Server Design. 19-28 - Yuqi Xue, Yiqi Liu, Lifeng Nai, Jian Huang:
Hardware-Assisted Virtualization of Neural Processing Units for Cloud Platforms. 29-36 - Shuangliang David Chen, Saptadeep Pal, Rakesh Kumar:
Waferscale Network Switches. 37-43 - Nandeeka Nayak, Toluwanimi O. Odemuyiwa, Xinrui Wu, Michael Pellauer, Joel S. Emer, Christopher W. Fletcher:
From TeAAL to FuseMax: Separation of Concerns for Attention Accelerator Design. 44-53 - Esha Choukse, Pratyush Patel, Chaojie Zhang, Aashaka Shah, Íñigo Goiri, Saeed Maleki, Rodrigo Fonseca, Ricardo Bianchini:
Splitwise: Efficient Generative LLM Inference Using Phase Splitting. 54-59 - Alexander Shypula, Aman Madaan, Yimeng Zeng, Uri Alon, Jacob R. Gardner, Milad Hashemi, Graham Neubig, Parthasarathy Ranganathan, Osbert Bastani, Amir Yazdanbakhsh:
Automated High-Level Code Optimization for Warehouse Performance. 60-71 - Jaime Roelandts, Ajeya Naithani, Sam Ainsworth, Timothy M. Jones, Lieven Eeckhout:
Scalar Vector Runahead: Removing the Shackles of Indirect Memory Chains on In-Order Cores. 72-78 - Martin Cochet, Karthik Swaminathan, Erik Loscalzo, Joseph Zuckerman, Maico Cassel dos Santos, Davide Giri, Alper Buyuktosunoglu, Tianyu Jia, David Brooks, Gu-Yeon Wei, Kenneth L. Shepard, Luca P. Carloni, Pradip Bose:
BlitzCoin: A Decentralized Hardware Solution for Power Management of Highly Heterogeneous Systems on Chip. 79-86 - Rhys Gretsch, Peiyang Song, Advait Madhavan, Jeremy Lau, Timothy Sherwood:
Delay-Space Arithmetic and Architecture. 87-94 - Zirui Neil Zhao, Adam Morrison, Christopher W. Fletcher, Josep Torrellas:
From Colocation to Exfiltration: Practical Cache Side-Channel Attacks in the Modern Public Cloud. 95-102 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part V. 104-109 - Shane Greenstein:
Prototype Competition and Breakthroughs. 110-112
Volume 45, Number 5, September - October 2025
- Hsien-Hsin S. Lee:
United Semiconductors of America. 4-5 - Chris Wilkerson:
Special Issue on Contemporary Industry Products 2025. 6-8 - Ian Schneider, Hui Xu, Stephan Benecke, David A. Patterson, Keguo Huang, Parthasarathy Ranganathan, Cooper Elsworth:
An Introduction to Life-Cycle Emissions of Artificial Intelligence Hardware. 9-19 - Heng Liao, Bingyang Liu, Xianping Chen, Zhigang Guo, Chuanning Cheng, Jianbing Wang, Xiangyu Chen, Peng Dong, Rui Meng, Wenjie Liu, Zhe Zhou, Ziyang Zhang, Yuhang Gai, Cunle Qian, Yi Xiong, Zhongwu Cheng, Jing Xia, Yuli Ma, Xi Chen, Wenhua Du, Shizhong Xiao, Chungang Li, Yong Qin, Liudong Xiong, Zhou Yu, Lv Chen, Lei Chen, Buyun Wang, Pei Wu, Junen Gao, Xiaochu Li, Jian He, Shizhuan Yan, Bill McColl:
UB-Mesh: A Hierarchically Localized nD-FullMesh Data Center Network Architecture. 20-29 - Satyam Srivastava, Akhil Arunkumar, Nithesh Kurella, Amrit Panda, Gaurav Jain, Purushotham Kamath, Mark Wutzke, Arun Tiruvur, Mayank Mike Gupta, Ilya Soloveychik, Vamsi Darsi, Malav Dalal, Vinayak Patankar, Sasidhar Dudyala, Senthil Duraisamy, Santhosh Ramchandran, Raghav Venkatasubramanian, Yuwei Qin, Xin Wang, Jayaprakash Balachandran, Ali Murat Gok, Piotr Wojciechowski, Saliya Ekanayake, Chris Ng, Ranju Sarma, Shubhankit Rathore, Tristan Trouwen, Siwei Zhuang, Chris J. Nicol, Sudeep Bhoja:
Corsair: An In-Memory Computing Chiplet Architecture for Inference-Time Compute Acceleration. 30-42 - Heetaek Jeong, Wonsik Lee, Eunjin Baek, Changsu Kim, Changyeon Jo, Dongju Chae, Kanghyun Choi, Hamin Jang, Mohamed A. Elgammal, Sungmin Hong, Eriko Nurvitadhi, Dongup Kwon, Jangwoo Kim:
MangoBoost Alice: Extremely Fast, Seamless, and Versatile FPGA-Accelerated DPU Solutions. 43-55 - Darshan Gandhi, Pushkar Nandkar, Nasim Farahini, Håkan Zeffer, John Long, Samuel Rydh, Matheen Musaddiq, Tuowen Zhao, Joshua Brot, Reid Goodbar, Yun Du, Mingran Wang, Raghu Prabhakar:
Speculative Decoding on the SN40L Reconfigurable Dataflow Unit. 56-66 - Gurpreet Singh Kalsi, Hong Wang, Jason Howard, Joshua B. Fryman, Fabrizio Petrini, Daniel S. Klowden, Sanjaya Tayal, Anil Rao, Steve Pawlowski:
BiFrost: A Composable, Resilient Interconnect Network Architecture for Scalable Artificial Intelligence Systems. 67-78 - Amin Firoozshahian, Joel Coburn, Ajit Punj, Aravind Sukumaran-Rajam, Colby Boyer, Rakesh Nattoji, Mahima Bathla, Bob Dreyer, Sujith Srinivasan, Harshitha Pilla, Michael Rotzin, Surendra Rajupalem, K. Rajesh Jagannath, Krishna Noru, Harikrishna Reddy, Chris Yang, Charlie Hong-Men Su, Charlie Cheng:
A Comparative Analysis of Loosely and Tightly Coupled Accelerator Architectures for Machine Learning. 79-93 - Jianping Zeng, Shuyi Pei, Da Zhang, Yuchen Zhou, Amir Beygi, Xuebin Yao, Ramdas Kachare, Tong Zhang, Zongwang Li, Marie Nguyen, Rekha Pitchumani, Yang Soek Ki, Changhee Jung:
Performance Characterizations and Usage Guidelines of Samsung CMM-H. 94-102 - Yejin Lee, Alicia Golden, Anna Y. Sun, Basil Hosmer, Bilge Acun, Can Balioglu, Changhan Wang, Charles David Hernandez, Christian Puhrsch, Daniel Haziza, Driss Guessous, Francisco Massa, Jacob Kahn, Jeffrey Wan, Jeremy Reizenstein, Jiaqi Zhai, Joe Isaacson, Joel Schlosser, Juan Pino, Kaushik Ram Sadagopan, Leonid Shamis, Linjian Ma, Min-Jae Hwang, Mingda Chen, Mostafa Elhoushi, Pedro Rodríguez, Ram Pasunuru, Samuel Hsia, Scott Yih, Sravya Popuri, Xing Liu, Carole-Jean Wu:
Characterizing and Efficiently Accelerating Multimodal Generation Model Inference. 103-115 - Manu Shamsa, Damion Searls, Samik Biswas, Steve Wong, Mariusz Oriol, Mateusz Duchalski, Rajesh Poornachandran, Jason Dutra, Felix Leung, Zoey Sun, Sam Whitlock, Pulkit A. Misra:
Unlocking Hardware Potential With Usage Meters. 116-125 - Gadi Singer:
Exploring Trends to Ride Artificial Intelligence's Explosive Growth Trajectory. 127-132 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part VI. 134-137 - Shane Greenstein:
Wireless Commercial Breakthrough. 138-140
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