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ORCIDInternational Conference on Remote Engineering and Virtual Instrumentation (REV)
19th REV 2022: Cairo, Egypt
- Michael E. Auer, Samir Abou El-Seoud, Omar H. Karam:
Artificial Intelligence and Online Engineering - Proceedings of the 19th International Conference on Remote Engineering and Virtual Instrumentation, British University, Cairo, Egypt, 28 February - 2 March 2022. Lecture Notes in Networks and Systems 524, Springer 2023, ISBN 978-3-031-17090-4 [contents]
18th REV 2021: Hongkong, China
- Michael E. Auer, Kalyan Ram Bhimavaram, Xiao-Guang Yue:
Online Engineering and Society 4.0 - Proceedings of the 18th International Conference on Remote Engineering and Virtual Instrumentation, REV 2021, Hongkong, China, 24-26 February 2021. Lecture Notes in Networks and Systems 298, Springer 2022, ISBN 978-3-030-82528-7 [contents]
17th REV 2020: Athens, GA, USA
- Michael E. Auer, Dominik May:
Cross Reality and Data Science in Engineering - Proceedings of the 17th International Conference on Remote Engineering and Virtual Instrumentation, REV 2020, Athens, GA, USA, 26-28 February, 2020. Advances in Intelligent Systems and Computing 1231, Springer 2021, ISBN 978-3-030-52574-3 [contents]
16th REV 2019: Banglore, India
- Michael E. Auer, Kalyan B. Ram:
Cyber-physical Systems and Digital Twins - Proceedings of the 16th International Conference on Remote Engineering and Virtual Instrumentation, REV 2019, Banglore, India, 3-6 February 2019. Springer 2020, ISBN 978-3-030-23161-3 [contents]
15th REV 2018: Düsseldorf, Germany
- Michael E. Auer, Reinhard Langmann:
Smart Industry & Smart Education - Proceedings of the 15th International Conference on Remote Engineering and Virtual Instrumentation, REV 2018, Düsseldorf, Germany, 21-23 March 2018. Springer 2019, ISBN 978-3-319-95677-0 [contents]
14th REV 2017: New York, NY, USA
- Michael E. Auer, Danilo Garbi Zutin:
Online Engineering & Internet of Things - Proceedings of the 14th International Conference on Remote Engineering and Virtual Instrumentation REV 2017, held 15-17 March 2017, Columbia University, New York, USA. Springer 2018, ISBN 978-3-319-64351-9 [contents]
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