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Publication search results
found 284 matches
- 2024
- Yuanyuan Han, Nor Haizan Mohamed Radzi, Noorfa Haszlinna Mustaffa, Jianbo Fan, Junzi Yang:
A predictive maintenance model for internet of things devices using long short-term memory and one-dimensional dilated group convolution with residual connection. Internet Things 25: 101090 (2024) - Xufei Li, Yin Chen, Jinxiao Zhu, Shuiguang Zeng, Yulong Shen, Xiaohong Jiang, Daqing Zhang:
Fractal Dimension of DSSS Frame Preamble: Radiometric Feature for Wireless Device Identification. IEEE Trans. Mob. Comput. 23(2): 1416-1430 (2024) - 2023
- Issei Makino, Nobuhiko Miki:
Open-Source Hardware-Based Three-Dimensional Positioning Device for Indoor Measurement and Positioning. IEEE Access 11: 11254-11267 (2023) - Taimur Ahmed, Vaishnavi Krishnamurthi, Arnan Mitchell, Sumeet Walia:
Operating Principle and Device Configuration Driven Mechanisms in Low-Dimensional Materials for Neuromorphics. Adv. Intell. Syst. 5(5) (2023) - Qin Cheng, Linghua Zhang, Bo Xue, Feng Shu, Xu Wang:
A generalized thresholding algorithm with dimension reduction for device-free localization in IoT. Appl. Intell. 53(8): 9089-9102 (2023) - Wanxia Zhao, Zeyad T. Alwahabi:
Two-dimensional imaging of excited N2 molecules produced in an air purification device. J. Vis. 26(3): 509-516 (2023) - Shizhong Guo:
Integrated three-dimensional Hall switch sensor based on independent optimized Hall devices. Microelectron. J. 135: 105756 (2023) - Shudan Han, Yubo Tian:
Structure parameter estimation method for microwave device using dimension reduction network. Int. J. Mach. Learn. Cybern. 14(4): 1285-1301 (2023) - Yue Li, Zhongqi Sun, Pengyun Li, Zhenhua Li, Jipeng Wang, Ling Zhou, Haiqiang Ma:
Polarization and orbital angular momentum coupling for high-dimensional measurement-device-independent quantum key distribution protocol. Quantum Inf. Process. 22(3): 147 (2023) - Xian Zhao, Bingbing Dong, Xiaoyue Wang:
Reliability analysis of a two-dimensional voting system equipped with protective devices considering triggering failures. Reliab. Eng. Syst. Saf. 232: 109038 (2023) - Rafal Bialek, Kamila Bialek:
Three Dimensional Membrane Vibration Measurement Using a Two Dimensional Position Sensitive Device. Sensors 23(1): 174 (2023) - Tae-Kyun Kim, Jong-Gwan Yook, Joo-Yong Kim, Yong-Ho Cho, Uh-Hyeon Lee:
Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. Sensors 23(14): 6350 (2023) - Junichi Mori, Makoto Morinaga, Takumi Asakura, Takenobu Tsuchiya, Ippei Yamamoto, Kentaro Nishino, Shigenori Yokoshima:
Three-Dimensional Positioning for Aircraft Using IoT Devices Equipped with a Fish-Eye Camera. Sensors 23(22): 9108 (2023) - Wei Sun, Zhongda Xu, Xin Li, Zhenning Chen, Xinqiao Tang:
Three-Dimensional Shape and Deformation Measurements Based on Fringe Projection Profilometry and Fluorescent Digital Image Correlation via a 3 Charge Coupled Device Camera. Sensors 23(15): 6663 (2023) - Zenan Wang, Jie Tao, Jun Tian, Jun Wei, Ying Hu:
Surface-Acoustic-Wave (SAW)-Driven Device for Three-Dimensional Cell Manipulation. IEEE Trans. Biomed. Eng. 70(3): 780-788 (2023) - David Geary, Jon Francombe, Kristian Hentschel, Damian T. Murphy:
Using design dimensions to develop a multi-device audio experience through workshops and prototyping. Audio Mostly Conference 2023: 71-78 - Zhou Wang, Jingchuan Wei, Boxiao Han, Hongjun He, Leibo Liu, Shaojun Wei, Shouyi Yin:
CPE: An Energy-Efficient Edge-Device Training with Multi-dimensional Compression Mechanism. DAC 2023: 1-6 - Andrew Boutros, Fatemehsadat Mahmoudi, Amin Mohaghegh, Stephen More, Vaughn Betz:
Into the Third Dimension: Architecture Exploration Tools for 3D Reconfigurable Acceleration Devices. ICFPT 2023: 198-208 - Wenwen Zhang, Xinyang Zhang, Tao Wang, Kaipeng Li:
Research on Distributed Multi-Dimensional Intelligent Device for Intelligent Cable Well Intrusion Detection. ICISCAE 2023: 432-436 - Vasyl Yatskiv, Taras Tsavolyk, Nataliya Yatskiv, Vasyl Koval, Stepan Ivasiev:
Algorithm and data encoding/decoding devices based on two-dimensional modular correction codes. IntelITSIS 2023: 388-400 - Mislav Matic, Mirko Poljak:
Transport Properties and Device Performance of Quasi-One-Dimensional MoS2 FETs. MIPRO 2023: 168-172 - Yunho Maeng, Kyunam Cho:
MULTI-DIMENSIONAL SENTIMENT VECTOR from Amazon HMD VR device review. IEEE DataPort, 2023 - Yejia Liu, Shijin Duan, Xiaolin Xu, Shaolei Ren:
MetaLDC: Meta Learning of Low-Dimensional Computing Classifiers for Fast On-Device Adaption. CoRR abs/2302.12347 (2023) - Benjamin Johnson, Bechir Hamdaoui:
Domain-Adaptive Device Fingerprints for Network Access Authentication Through Multifractal Dimension Representation. CoRR abs/2308.07925 (2023) - 2022
- Hyo-Seok Hwang, Minhyeok Lee, Junhee Seok:
Deep reinforcement learning with a critic-value-based branch tree for the inverse design of two-dimensional optical devices. Appl. Soft Comput. 127: 109386 (2022) - Logan Bishop-Van Horn, Kathryn A. Moler:
SuperScreen: An open-source package for simulating the magnetic response of two-dimensional superconducting devices. Comput. Phys. Commun. 280: 108464 (2022) - Xing Xin, Liyao Sun, Jiamei Chen, Youzhe Bao, Ye Tao, Ya Lin, Jingyao Bian, Zhongqiang Wang, Xiaoning Zhao, Haiyang Xu, Yichun Liu:
Real-time numerical system convertor via two-dimensional WS2-based memristive device. Frontiers Comput. Neurosci. 16 (2022) - Daniele Leonardis, Massimiliano Gabardi, Michele Barsotti, Antonio Frisoli:
Discrete Cutaneous Feedback for Reducing Dimensions of Wearable Haptic Devices. Frontiers Virtual Real. 3: 820266 (2022) - Qianru Zhang, Qin Wang, Linbo Zhang, Benzhuo Lu:
A class of finite element methods with averaging techniques for solving the three-dimensional drift-diffusion model in semiconductor device simulations. J. Comput. Phys. 458: 111086 (2022) - Christof Kauba, Martin Drahanský, Marie Nováková, Andreas Uhl, Stepán Rydlo:
Three-Dimensional Finger Vein Recognition: A Novel Mirror-Based Imaging Device. J. Imaging 8(5): 148 (2022)
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