BibTeX record journals/todaes/WuPL23

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@article{DBLP:journals/todaes/WuPL23,
  author       = {Jun{-}Sheng Wu and
                  Chi{-}An Pan and
                  Yi{-}Yu Liu},
  title        = {ILP-based Substrate Routing with Mismatched Via Dimension Consideration
                  for Wire-bonding {FBGA} Package Design},
  journal      = {{ACM} Trans. Design Autom. Electr. Syst.},
  volume       = {28},
  number       = {5},
  pages        = {77:1--77:26},
  year         = {2023},
  url          = {https://doi.org/10.1145/3579843},
  doi          = {10.1145/3579843},
  timestamp    = {Fri, 27 Oct 2023 20:39:59 +0200},
  biburl       = {https://dblp.org/rec/journals/todaes/WuPL23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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