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"ILP-based Substrate Routing with Mismatched Via Dimension Consideration ..."
Jun-Sheng Wu, Chi-An Pan, Yi-Yu Liu (2023)
- Jun-Sheng Wu
, Chi-An Pan
, Yi-Yu Liu
:
ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design. ACM Trans. Design Autom. Electr. Syst. 28(5): 77:1-77:26 (2023)
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