BibTeX record journals/tcad/PakLP14

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@article{DBLP:journals/tcad/PakLP14,
  author       = {Jiwoo Pak and
                  Sung Kyu Lim and
                  David Z. Pan},
  title        = {Electromigration Study for Multiscale Power/Ground Vias in TSV-Based
                  3-D ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {33},
  number       = {12},
  pages        = {1873--1885},
  year         = {2014},
  url          = {https://doi.org/10.1109/TCAD.2014.2360456},
  doi          = {10.1109/TCAD.2014.2360456},
  timestamp    = {Sun, 02 Oct 2022 15:50:16 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/PakLP14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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