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"Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs."
Jiwoo Pak, Sung Kyu Lim, David Z. Pan (2014)
- Jiwoo Pak, Sung Kyu Lim, David Z. Pan:
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12): 1873-1885 (2014)
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