BibTeX record journals/tcad/MakLCW12

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@article{DBLP:journals/tcad/MakLCW12,
  author       = {Wai{-}Kei Mak and
                  Yu{-}Chen Lin and
                  Chris Chu and
                  Ting{-}Chi Wang},
  title        = {Pad Assignment for Die-Stacking System-in-Package Design},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {31},
  number       = {11},
  pages        = {1711--1722},
  year         = {2012},
  url          = {https://doi.org/10.1109/TCAD.2012.2202395},
  doi          = {10.1109/TCAD.2012.2202395},
  timestamp    = {Thu, 24 Sep 2020 11:28:43 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/MakLCW12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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