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"Pad Assignment for Die-Stacking System-in-Package Design."

Wai-Kei Mak et al. (2012)

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DOI: 10.1109/TCAD.2012.2202395

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/MakLCW12
Wai-Kei Mak, Yu-Chen Lin, Chris Chu, Ting-Chi Wang:
Pad Assignment for Die-Stacking System-in-Package Design. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(11): 1711-1722 (2012)

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