BibTeX record journals/tcad/LiYM06

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@article{DBLP:journals/tcad/LiYM06,
  author       = {Hong Li and
                  Wen{-}Yan Yin and
                  Junfa Mao},
  title        = {Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for
                  Circuit Simulations and a Comparison With Cu Interconnects for Sealed
                  Technologies"},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {25},
  number       = {12},
  pages        = {3042--3044},
  year         = {2006},
  url          = {https://doi.org/10.1109/TCAD.2006.883920},
  doi          = {10.1109/TCAD.2006.883920},
  timestamp    = {Thu, 24 Sep 2020 11:28:22 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/LiYM06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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