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"Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for ..."

Hong Li, Wen-Yan Yin, Junfa Mao (2006)

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DOI: 10.1109/TCAD.2006.883920

access: closed

type: Journal Article

metadata version: 2020-09-24

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Hong Li, Wen-Yan Yin, Junfa Mao:
Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies". IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(12): 3042-3044 (2006)

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