BibTeX record journals/tcad/JiangXE13

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@article{DBLP:journals/tcad/JiangXE13,
  author       = {Li Jiang and
                  Qiang Xu and
                  Bill Eklow},
  title        = {On Effective Through-Silicon Via Repair for 3-D-Stacked ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {32},
  number       = {4},
  pages        = {559--571},
  year         = {2013},
  url          = {https://doi.org/10.1109/TCAD.2012.2228742},
  doi          = {10.1109/TCAD.2012.2228742},
  timestamp    = {Tue, 21 Mar 2023 21:09:31 +0100},
  biburl       = {https://dblp.org/rec/journals/tcad/JiangXE13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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