BibTeX record journals/mr/UddinACC04

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@article{DBLP:journals/mr/UddinACC04,
  author       = {M. A. Uddin and
                  M. O. Alam and
                  Yan Cheong Chan and
                  H. P. Chan},
  title        = {Adhesion strength and contact resistance of flip chip on flex packages--effect
                  of curing degree of anisotropic conductive film},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {3},
  pages        = {505--514},
  year         = {2004},
  url          = {https://doi.org/10.1016/S0026-2714(03)00185-9},
  doi          = {10.1016/S0026-2714(03)00185-9},
  timestamp    = {Wed, 20 Jul 2022 10:55:47 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/UddinACC04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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