"Adhesion strength and contact resistance of flip chip on flex ..."

M. A. Uddin et al. (2004)

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DOI: 10.1016/S0026-2714(03)00185-9

access: closed

type: Journal Article

metadata version: 2022-07-20

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M. A. Uddin, M. O. Alam, Yan Cheong Chan, H. P. Chan:
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectron. Reliab. 44(3): 505-514 (2004)

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