BibTeX record journals/mr/TanCCLS04

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@article{DBLP:journals/mr/TanCCLS04,
  author       = {C. W. Tan and
                  Y. C. Chan and
                  H. P. Chan and
                  N. W. Leung and
                  C. K. So},
  title        = {Investigation on bondability and reliability of UV-curable adhesive
                  joints for stable mechanical properties in photonic device packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {5},
  pages        = {823--831},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.10.003},
  doi          = {10.1016/J.MICROREL.2003.10.003},
  timestamp    = {Sat, 22 Feb 2020 19:27:09 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/TanCCLS04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}