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"Investigation on bondability and reliability of UV-curable adhesive joints ..."

C. W. Tan et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.10.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectron. Reliab. 44(5): 823-831 (2004)

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