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BibTeX record journals/mr/OngHVSJLSWROOZSLLYCYTS10
@article{DBLP:journals/mr/OngHVSJLSWROOZSLLYCYTS10, author = {Yue Ying Ong and Soon Wee Ho and Kripesh Vaidyanathan and Vasarla Nagendra Sekhar and Ming Chinq Jong and Samuel Lim Yak Long and Vincent Lee Wen Sheng and Leong Ching Wai and Vempati Srinivasa Rao and Jimmy Ong and Xuefen Ong and Xiaowu Zhang and Yoon Uk Seung and John H. Lau and Yeow Kheng Lim and David Yeo and Kai Chong Chan and Yanfeng Zhang and Juan Boon Tan and Dong Kyun Sohn}, title = {Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package}, journal = {Microelectron. Reliab.}, volume = {50}, number = {7}, pages = {986--994}, year = {2010}, url = {https://doi.org/10.1016/j.microrel.2010.03.010}, doi = {10.1016/J.MICROREL.2010.03.010}, timestamp = {Wed, 27 Sep 2023 14:36:52 +0200}, biburl = {https://dblp.org/rec/journals/mr/OngHVSJLSWROOZSLLYCYTS10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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