BibTeX record journals/mr/OngHVSJLSWROOZSLLYCYTS10

• > Home > journals/mr/OngHVSJLSWROOZSLLYCYTS10

@article{DBLP:journals/mr/OngHVSJLSWROOZSLLYCYTS10,
  author       = {Yue Ying Ong and
                  Soon Wee Ho and
                  Kripesh Vaidyanathan and
                  Vasarla Nagendra Sekhar and
                  Ming Chinq Jong and
                  Samuel Lim Yak Long and
                  Vincent Lee Wen Sheng and
                  Leong Ching Wai and
                  Vempati Srinivasa Rao and
                  Jimmy Ong and
                  Xuefen Ong and
                  Xiaowu Zhang and
                  Yoon Uk Seung and
                  John H. Lau and
                  Yeow Kheng Lim and
                  David Yeo and
                  Kai Chong Chan and
                  Yanfeng Zhang and
                  Juan Boon Tan and
                  Dong Kyun Sohn},
  title        = {Design, assembly and reliability of large die and fine-pitch Cu/low-k
                  flip chip package},
  journal      = {Microelectron. Reliab.},
  volume       = {50},
  number       = {7},
  pages        = {986--994},
  year         = {2010},
  url          = {https://doi.org/10.1016/j.microrel.2010.03.010},
  doi          = {10.1016/J.MICROREL.2010.03.010},
  timestamp    = {Wed, 27 Sep 2023 14:36:52 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/OngHVSJLSWROOZSLLYCYTS10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}