"Design, assembly and reliability of large die and fine-pitch Cu/low-k flip ..."

Yue Ying Ong et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.03.010

access: closed

type: Journal Article

metadata version: 2023-09-27

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Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn:
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab. 50(7): 986-994 (2010)

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