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BibTeX record journals/mr/KimYKKCC03
@article{DBLP:journals/mr/KimYKKCC03, author = {Kyung{-}Seob Kim and C. H. Yu and Nam{-}Hoon Kim and N. K. Kim and H. J. Chang and E. G. Chang}, title = {Isothermal aging characteristics of Sn-Pb micro solder bumps}, journal = {Microelectron. Reliab.}, volume = {43}, number = {5}, pages = {757--763}, year = {2003}, url = {https://doi.org/10.1016/S0026-2714(03)00060-X}, doi = {10.1016/S0026-2714(03)00060-X}, timestamp = {Thu, 31 Aug 2023 16:23:36 +0200}, biburl = {https://dblp.org/rec/journals/mr/KimYKKCC03.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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