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"Isothermal aging characteristics of Sn-Pb micro solder bumps."
Kyung-Seob Kim et al. (2003)
- Kyung-Seob Kim, C. H. Yu, Nam-Hoon Kim
, N. K. Kim, H. J. Chang, E. G. Chang:
Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectron. Reliab. 43(5): 757-763 (2003)
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