BibTeX record journals/mr/GanH15a

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@article{DBLP:journals/mr/GanH15a,
  author       = {Chong Leong Gan and
                  Uda Hashim},
  title        = {Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging),
                  {XVII.} Springer (2015), 322, {ISBN:} 978-1-4939-1555-2},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {11},
  pages        = {2481},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2015.08.007},
  doi          = {10.1016/J.MICROREL.2015.08.007},
  timestamp    = {Sat, 22 Feb 2020 19:27:08 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GanH15a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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