BibTeX record journals/mr/GainCY11

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@article{DBLP:journals/mr/GainCY11,
  author       = {Asit Kumar Gain and
                  Y. C. Chan and
                  Winco K. C. Yung},
  title        = {Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt{\%}
                  nano-TiO\({}_{\mbox{2}}\) composite solder on flexible ball grid array
                  substrates},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {5},
  pages        = {975--984},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2011.01.006},
  doi          = {10.1016/J.MICROREL.2011.01.006},
  timestamp    = {Sat, 22 Feb 2020 19:29:30 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GainCY11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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