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"Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% ..."

Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung (2011)

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DOI: 10.1016/J.MICROREL.2011.01.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/GainCY11
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO₂ composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51(5): 975-984 (2011)

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