BibTeX record journals/mr/CheZL16

download as .bib file

@article{DBLP:journals/mr/CheZL16,
  author       = {Fa Xing Che and
                  Xiaowu Zhang and
                  Jong{-}Kai Lin},
  title        = {Reliability study of 3D {IC} packaging based on through-silicon interposer
                  {(TSI)} and silicon-less interconnection technology {(SLIT)} using
                  finite element analysis},
  journal      = {Microelectron. Reliab.},
  volume       = {61},
  pages        = {64--70},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2015.12.041},
  doi          = {10.1016/J.MICROREL.2015.12.041},
  timestamp    = {Mon, 26 Oct 2020 08:59:23 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/CheZL16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.