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"Reliability study of 3D IC packaging based on through-silicon interposer ..."

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin (2016)

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DOI: 10.1016/J.MICROREL.2015.12.041

access: closed

type: Journal Article

metadata version: 2020-10-26

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Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin:
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. 61: 64-70 (2016)

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