BibTeX record journals/ieiceee/OhbaKMMFK15

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@article{DBLP:journals/ieiceee/OhbaKMMFK15,
  author       = {Takayuki Ohba and
                  Young{-}Suk Kim and
                  Yoriko Mizushima and
                  Nobuhide Maeda and
                  Koji Fujimoto and
                  Shoichi Kodama},
  title        = {Review of wafer-level three-dimensional integration {(3DI)} using
                  bumpless interconnects for tera-scale generation},
  journal      = {{IEICE} Electron. Express},
  volume       = {12},
  number       = {7},
  pages        = {20152002},
  year         = {2015},
  url          = {https://doi.org/10.1587/elex.12.20152002},
  doi          = {10.1587/ELEX.12.20152002},
  timestamp    = {Fri, 12 Feb 2021 22:20:58 +0100},
  biburl       = {https://dblp.org/rec/journals/ieiceee/OhbaKMMFK15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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