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"Review of wafer-level three-dimensional integration (3DI) using bumpless ..."
Takayuki Ohba et al. (2015)
- Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama:
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12(7): 20152002 (2015)
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