BibTeX record conf/rws/CaoSWGPK20

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@inproceedings{DBLP:conf/rws/CaoSWGPK20,
  author       = {Zhibo Cao and
                  Matteo Stocchi and
                  Matthias Wietstruck and
                  Federico Garbuglia and
                  Diego Pincini and
                  Mehmet Kaynak},
  title        = {Advanced Thermal Modeling of {IC} - Package Interaction},
  booktitle    = {2020 {IEEE} Radio and Wireless Symposium, {RWS} 2020, San Antonio,
                  TX, USA, January 26-29, 2020},
  pages        = {326--329},
  publisher    = {{IEEE}},
  year         = {2020},
  url          = {https://doi.org/10.1109/RWS45077.2020.9050057},
  doi          = {10.1109/RWS45077.2020.9050057},
  timestamp    = {Wed, 15 Apr 2020 16:04:51 +0200},
  biburl       = {https://dblp.org/rec/conf/rws/CaoSWGPK20.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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