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"Advanced Thermal Modeling of IC - Package Interaction."

Zhibo Cao et al. (2020)

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DOI: 10.1109/RWS45077.2020.9050057

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-15

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  dblp key:
  - conf/rws/CaoSWGPK20
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  - https://dblp.org/rec/conf/rws/CaoSWGPK20
Zhibo Cao, Matteo Stocchi, Matthias Wietstruck, Federico Garbuglia, Diego Pincini, Mehmet Kaynak:
Advanced Thermal Modeling of IC - Package Interaction. RWS 2020: 326-329

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