BibTeX record conf/itc/BurdickD94

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@inproceedings{DBLP:conf/itc/BurdickD94,
  author       = {William E. Burdick Jr. and
                  Wolfgang Daum},
  title        = {High-Yield Multichip Modules Based on Minimal {IC} Pretest},
  booktitle    = {Proceedings {IEEE} International Test Conference 1994, {TEST:} The
                  Next 25 Years, Washington, DC, USA, October 2-6, 1994},
  pages        = {30--40},
  publisher    = {{IEEE} Computer Society},
  year         = {1994},
  url          = {https://doi.org/10.1109/TEST.1994.527933},
  doi          = {10.1109/TEST.1994.527933},
  timestamp    = {Thu, 23 Mar 2023 23:58:41 +0100},
  biburl       = {https://dblp.org/rec/conf/itc/BurdickD94.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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