"High-Yield Multichip Modules Based on Minimal IC Pretest."

William E. Burdick Jr., Wolfgang Daum (1994)

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DOI: 10.1109/TEST.1994.527933

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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William E. Burdick Jr., Wolfgang Daum:
High-Yield Multichip Modules Based on Minimal IC Pretest. ITC 1994: 30-40

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