BibTeX record conf/isscc/SmithCPSWHJKMM24

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@inproceedings{DBLP:conf/isscc/SmithCPSWHJKMM24,
  author       = {Alan Smith and
                  Eric Chapman and
                  Chintan Patel and
                  Raja Swaminathan and
                  John J. Wuu and
                  Tyrone Huang and
                  Wonjun Jung and
                  Alexander Kaganov and
                  Hugh McIntyre and
                  Ramon Mangaser},
  title        = {11.1 {AMD} InstinctTM {MI300} Series Modular Chiplet Package - {HPC}
                  and {AI} Accelerator for Exa-Class Systems},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2024,
                  San Francisco, CA, USA, February 18-22, 2024},
  pages        = {490--492},
  publisher    = {{IEEE}},
  year         = {2024},
  url          = {https://doi.org/10.1109/ISSCC49657.2024.10454441},
  doi          = {10.1109/ISSCC49657.2024.10454441},
  timestamp    = {Tue, 19 Mar 2024 09:04:31 +0100},
  biburl       = {https://dblp.org/rec/conf/isscc/SmithCPSWHJKMM24.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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