BibTeX record conf/isscc/NiuLWHZGGSXDFZJ22

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@inproceedings{DBLP:conf/isscc/NiuLWHZGGSXDFZJ22,
  author       = {Dimin Niu and
                  Shuangchen Li and
                  Yuhao Wang and
                  Wei Han and
                  Zhe Zhang and
                  Yijin Guan and
                  Tianchan Guan and
                  Fei Sun and
                  Fei Xue and
                  Lide Duan and
                  Yuanwei Fang and
                  Hongzhong Zheng and
                  Xiping Jiang and
                  Song Wang and
                  Fengguo Zuo and
                  Yubing Wang and
                  Bing Yu and
                  Qiwei Ren and
                  Yuan Xie},
  title        = {184QPS/W 64Mb/mm\({}^{\mbox{2}}\)3D Logic-to-DRAM Hybrid Bonding with
                  Process-Near-Memory Engine for Recommendation System},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2022,
                  San Francisco, CA, USA, February 20-26, 2022},
  pages        = {1--3},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/ISSCC42614.2022.9731694},
  doi          = {10.1109/ISSCC42614.2022.9731694},
  timestamp    = {Tue, 21 Jun 2022 09:39:44 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/NiuLWHZGGSXDFZJ22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}