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"184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with ..."
Dimin Niu et al. (2022)
- Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, Fei Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie:
184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. ISSCC 2022: 1-3
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