BibTeX record conf/irps/OsmansonKMKGK21

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@inproceedings{DBLP:conf/irps/OsmansonKMKGK21,
  author       = {Allison T. Osmanson and
                  Mohsen Tajedini and
                  Yi Ram Kim and
                  Hossein Madanipour and
                  Choong{-}Un Kim and
                  Bradley Glasscock and
                  Muhammad Khan},
  title        = {Mechanisms of Contact Formation and Electromigration Reliability in
                  Wirebond Packages},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2021, Monterey,
                  CA, USA, March 21-25, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/IRPS46558.2021.9405131},
  doi          = {10.1109/IRPS46558.2021.9405131},
  timestamp    = {Thu, 20 May 2021 08:27:17 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/OsmansonKMKGK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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