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BibTeX record conf/irps/OsmansonKMKGK21
@inproceedings{DBLP:conf/irps/OsmansonKMKGK21, author = {Allison T. Osmanson and Mohsen Tajedini and Yi Ram Kim and Hossein Madanipour and Choong{-}Un Kim and Bradley Glasscock and Muhammad Khan}, title = {Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2021, Monterey, CA, USA, March 21-25, 2021}, pages = {1--6}, publisher = {{IEEE}}, year = {2021}, url = {https://doi.org/10.1109/IRPS46558.2021.9405131}, doi = {10.1109/IRPS46558.2021.9405131}, timestamp = {Thu, 20 May 2021 08:27:17 +0200}, biburl = {https://dblp.org/rec/conf/irps/OsmansonKMKGK21.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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