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"Mechanisms of Contact Formation and Electromigration Reliability in ..."

Allison T. Osmanson et al. (2021)

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DOI: 10.1109/IRPS46558.2021.9405131

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-20

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  dblp key:
  - conf/irps/OsmansonKMKGK21
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  - https://dblp.org/rec/conf/irps/OsmansonKMKGK21
Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan:
Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages. IRPS 2021: 1-6

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