default search action
BibTeX record conf/irps/HuKHMSOCPPASQGB18
@inproceedings{DBLP:conf/irps/HuKHMSOCPPASQGB18, author = {Chao{-}Kun Hu and James J. Kelly and Huai Huang and Koichi Motoyama and Hosadurga Shobha and Yuri Ostrovski and James H.{-}C. Chen and Raghuveer Patlolla and Brown Peethala and Praneet Adusumilli and Terry A. Spooner and Roger Quon and Lynne M. Gignac and Chris M. Breslin and G. Lian and M. Ali and Jacob Benedict and X. S. Lin and S. Smith and Vimal Kamineni and X. Zhang and Frank Wilhelm Mont and Shariq Siddiqui and Frieder H. Baumann}, title = {Future on-chip interconnect metallization and electromigration}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame, CA, USA, March 11-15, 2018}, pages = {4}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/IRPS.2018.8353597}, doi = {10.1109/IRPS.2018.8353597}, timestamp = {Fri, 08 Sep 2023 15:33:34 +0200}, biburl = {https://dblp.org/rec/conf/irps/HuKHMSOCPPASQGB18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.