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"Future on-chip interconnect metallization and electromigration."
Chao-Kun Hu et al. (2018)
- Chao-Kun Hu, James J. Kelly, Huai Huang
, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann:
Future on-chip interconnect metallization and electromigration. IRPS 2018: 4
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