BibTeX record conf/icta3/KangLNW22

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@inproceedings{DBLP:conf/icta3/KangLNW22,
  author       = {Qiushi Kang and
                  Ge Li and
                  Fanfan Niu and
                  Chenxi Wang},
  title        = {Cooperative surface-activation strategy for low-temperature Cu/SiO2
                  hybrid bonding},
  booktitle    = {2022 {IEEE} International Conference on Integrated Circuits, Technologies
                  and Applications, {ICTA} 2022, Xi'an, China, October 28-30, 2022},
  pages        = {40--41},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/ICTA56932.2022.9963057},
  doi          = {10.1109/ICTA56932.2022.9963057},
  timestamp    = {Thu, 16 Nov 2023 15:13:51 +0100},
  biburl       = {https://dblp.org/rec/conf/icta3/KangLNW22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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