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"Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid ..."

Qiushi Kang et al. (2022)

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DOI: 10.1109/ICTA56932.2022.9963057

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-16

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  dblp key:
  - conf/icta3/KangLNW22
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  - https://dblp.org/rec/conf/icta3/KangLNW22
Qiushi Kang, Ge Li, Fanfan Niu, Chenxi Wang:
Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding. ICTA 2022: 40-41

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