BibTeX record conf/icse/YanCMJHLTCLXGLWSC23

• > Home > conf/icse/YanCMJHLTCLXGLWSC23

@inproceedings{DBLP:conf/icse/YanCMJHLTCLXGLWSC23,
  author       = {Ming Yan and
                  Junjie Chen and
                  Hangyu Mao and
                  Jiajun Jiang and
                  Jianye Hao and
                  Xingjian Li and
                  Zhao Tian and
                  Zhichao Chen and
                  Dong Li and
                  Zhangkong Xian and
                  Yanwei Guo and
                  Wulong Liu and
                  Bin Wang and
                  Yuefeng Sun and
                  Yongshun Cui},
  title        = {Achieving Last-Mile Functional Coverage in Testing Chip Design Software
                  Implementations},
  booktitle    = {45th {IEEE/ACM} International Conference on Software Engineering:
                  Software Engineering in Practice, SEIP@ICSE 2023, Melbourne, Australia,
                  May 14-20, 2023},
  pages        = {343--354},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ICSE-SEIP58684.2023.00037},
  doi          = {10.1109/ICSE-SEIP58684.2023.00037},
  timestamp    = {Tue, 19 Sep 2023 16:49:46 +0200},
  biburl       = {https://dblp.org/rec/conf/icse/YanCMJHLTCLXGLWSC23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}