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"Achieving Last-Mile Functional Coverage in Testing Chip Design Software ..."

Ming Yan et al. (2023)

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DOI: 10.1109/ICSE-SEIP58684.2023.00037

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-19

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  dblp key:
  - conf/icse/YanCMJHLTCLXGLWSC23
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  persistent URL:
  - https://dblp.org/rec/conf/icse/YanCMJHLTCLXGLWSC23
Ming Yan, Junjie Chen, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui:
Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. ICSE-SEIP 2023: 343-354

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