BibTeX record conf/dsde/WangFLW21

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@inproceedings{DBLP:conf/dsde/WangFLW21,
  author       = {Min Wang and
                  Mengrou Feng and
                  Xikun Lu and
                  Ran Wei},
  title        = {Analysis and Test of {PCB} via Hole Heat Dissipation Performance in
                  Circuit Practice Course},
  booktitle    = {{DSDE} '21: 2021 4th International Conference on Data Storage and
                  Data Engineering, Barcelona, Spain, February 18-20, 2021},
  pages        = {161--165},
  publisher    = {{ACM}},
  year         = {2021},
  url          = {https://doi.org/10.1145/3456146.3456171},
  doi          = {10.1145/3456146.3456171},
  timestamp    = {Thu, 22 Jul 2021 12:46:04 +0200},
  biburl       = {https://dblp.org/rec/conf/dsde/WangFLW21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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